Recent development (unreleased)

This document describes the major changes that are expected to be included in the next release of flashrom and which are currently only available by source code checkout (see Building from source). These changes may be further revised before the next release.

Multi-die flash chip support preparation

Feature is currently under development. Supporting multi-die flash chips. Added two new fields in the struct flashchip definition:

• .die_size - Size of a single die in kilobytes. Set for multi-die chips.

• .die_select - callback for die selection. Different vendors can use different opcodes and methods to select active dies.

This enables future support for multi-die flash chips without affecting existing single-die chip support. Chip definitions can now be prepared with die information ahead of time, and custom read/write functions can leverage this information for die-aware operations.